High Speed VLSI Interconnections

Le prix initial était : 195.00 €.Le prix actuel est : 11.70 €.

Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections. This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC…

Passer à la caisse
SKU: IZTSYZS0059562404785
Category:

Description

Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections.

This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections

In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.

Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:

  • Preliminary Concepts

  • Parasitic Resistances, Capacitances, and Inductances

  • Interconnection Delays

  • Crosstalk Analysis

  • Electromigration-Induced Failure Analysis

  • Future Interconnections

High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.

This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.

Langue
en
Version
Couverture rigide
Date de sortie initiale
05 octobre 2007
Nombre de pages
432
Illustrations
Non

Personnes impliquées

Auteur principal

Ashok K Goel

Editeur principal

WILQ

Informations sur le fabricant

Nom du fabricant
Easy Access System Europe Oü, 16879218
Adresse du fabricant
– 10621 – – EE
Adresse électronique du fabricant
gpsr.requests@easproject.com

Autres spécifications

Hauteur de l’emballage
32 mm
Hauteur du produit
32 mm
Largeur d’emballage
165 mm
Largeur du produit
165 mm
Livre d‘étude
Oui
Longueur d’emballage
241 mm
Longueur du produit
241 mm
Poids de l’emballage
726 g
Police de caractères extra large
Non
Édition
2

EAN

EAN
9780471780465

Sécurité des produits

Opérateur économique responsable dans l’UE

Afficher les données

Vous trouverez cet article :

Catégories

Technologie et architecture

Technologie de communication

Électrotechnique

Chaînes électriques et composants

Livres

Livre, ebook ou livre audio ?

Livre

Disponibilité

Disponible à l’adresse suivante

Langue

Anglais

Type de livre

Hardcover

Produits similaires