Description
Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections.
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections
In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.
Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:
-
Preliminary Concepts
-
Parasitic Resistances, Capacitances, and Inductances
-
Interconnection Delays
-
Crosstalk Analysis
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Electromigration-Induced Failure Analysis
-
Future Interconnections
High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
- Langue
- en
- Version
- Couverture rigide
- Date de sortie initiale
- 05 octobre 2007
- Nombre de pages
- 432
- Illustrations
- Non
Personnes impliquées
- Auteur principal
-
Ashok K Goel
- Editeur principal
-
WILQ
Informations sur le fabricant
- Nom du fabricant
- Easy Access System Europe Oü, 16879218
- Adresse du fabricant
- – 10621 – – EE
- Adresse électronique du fabricant
- gpsr.requests@easproject.com
Autres spécifications
- Hauteur de l’emballage
- 32 mm
- Hauteur du produit
- 32 mm
- Largeur d’emballage
- 165 mm
- Largeur du produit
- 165 mm
- Livre d‘étude
- Oui
- Longueur d’emballage
- 241 mm
- Longueur du produit
- 241 mm
- Poids de l’emballage
- 726 g
- Police de caractères extra large
- Non
- Édition
- 2
EAN
- EAN
- 9780471780465
Sécurité des produits
- Opérateur économique responsable dans l’UE
-
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Vous trouverez cet article :
- Catégories
-
Technologie et architecture
Technologie de communication
Électrotechnique
Chaînes électriques et composants
Livres
- Livre, ebook ou livre audio ?
-
Livre
- Disponibilité
-
Disponible à l’adresse suivante
- Langue
-
Anglais
- Type de livre
-
Hardcover





